CCD camera automatic positioning UV laser marking engraving machine. It directly interrupts the molecular chain of the material through the short wavelength laser, so as to show the required etching pattern and text.
This machine in the ordinary marking machine based on the addition of 5 million pixels CCD camera, can realize automatic positioning, automatic marking. The positioning accuracy is up to 0.1mm.
You can place the marking items in any position on the conveyor table, the machine can automatically locate and marking and transmission, very suitable for mass production and assembly line operation.
UV laser marking engraving machine due to the focusing spot is very small, and processing heat affected zone is small, so it can be ultra-fine marking, special material marking, is the first choice for customers who have higher requirements for marking effect.
Product features
1. UV laser marking engraving machine using 355nm pumping violet laser device as a light source, focused spot is small, can reduce the mechanical deformation of the material and processing heat impact is small.
2. on the basis of ordinary marking machine increased CCD automatic positioning vision system, CCD scanning area is larger, no error.
3. CCD camera can be automatically positioned, marking items can be placed arbitrarily, CCD camera can be automatically recognized, accurate positioning and marking.
4. It can be easily marked without positioning fixture, which greatly saves working time and material cost.
5. equipped with conveyor belt, can be automated batch marking, marking speed, high efficiency.
6. Marking width can reach 175mm×175mm, which can meet the marking size requirements of various precision devices.
7. adopts domestic high quality CW-5000 chiller with cooling function, stable performance, good heat dissipation effect, higher cooling efficiency.
8. Support AI, BMP, DST, DWG, DXF, DXP, LAS, PLT and other image formats.
9. Camera software support win7, win10, win11 computer system.
Applications UV laser marking and engraving machine is mainly used for ultra-fine marking and engraving, especially suitable for food, pharmaceutical packaging materials marking, micro-hole punching, high-speed division of glass materials and complex graphic cutting of silicon wafers and other application areas.