Technical Index:
Desktop ultraviolet laser marking machine using 355nm ultraviolet laser research and development, the machine adopts the third-order cavity frequency doubling technology with infrared laser comparison, 355 ultraviolet light focusing spot is very small, marking effect is through the short-wavelength laser directly interrupt the molecular chain of the material, to a large extent, to reduce the mechanical deformation of the material, deformation of the heat (is a cold light), because it is mainly used for ultra-fine marking, engraving, especially suitable for Used for food, pharmaceutical packaging materials marking, playing microporous, high-speed division of glass materials and silicon wafers for complex graphic cutting and other application industries. Ultraviolet laser is pumped by a high-power multimode laser diode to produce laser and then multiply the frequency produced by the ultraviolet laser beam, and then through the computer-controlled high-speed scanning galvanometer deflection to change the laser beam optical path to achieve automatic marking.
UV laser marking machine industry applications
Mainly used in ultra-fine processing of high-end markets, pharmaceuticals, cosmetics, video and other polymer materials, packaging bottles surface marking, the effect is very fine, marking cleaning firm, better than inkjet and no pollution; flexible pcb board marking, scribing; silicon wafer
microporous, blind holes processing; LCD LCD liquid crystal glass two-dimensional code marking, glass appliance surface perforation, metal surface plating marking, plastic buttons, Electronic components, gifts, communication equipment, construction materials and so on.
Working environment requirements
The ambient temperature is between -5-40℃, air conditioning is required.
Humidity requirement is 40%-80%. No condensation, should be installed dehumidifier.
Power supply grid fluctuation: ±5%, grid ground in line with international requirements. Areas with voltage amplitude of 5% or more should be equipped with automatic voltage and current stabilizers.
There should be no strong electromagnetic signal interference near the installation equipment. Avoid radio transmitting stations (or relay stations) around the installation site.
Foundation amplitude: less than 50um; vibration acceleration: less than 0.05g. Avoid a large number of stamping and other machine tool equipment in the vicinity.
Equipment space requirements to ensure that no smoke and dust, to avoid metal polishing and grinding and other dusty working environment. Air pressure: 86-106kpa.
| Laser Type | UV Laser |
|---|---|
| Beam quality | m2 <1.5 |
| Laser Power | 3w, 5w, 10w Optional |
| Minimum line width | 0μm |
| Minimum character | 0.15mm |
| Marking depth | 0-0.3mm |
| Engraving speed | 0-7000mm/s |
| Minimum line width | 0.01mm |
| Repeatability accuracy | ±0.001mm |
| Power Supply | 110/220V ± 10% /,50/60HZ |
| Cooling way | Air cooling |
| Communications | USB |
| Graphics File Types Accepted | PLT, BMP, JPG, PNG, TIP, PCX, TGA, ICO, DXF |
| operating system | Windows xp/7/8/10/11 |
| Dimensions | 34x54x88cm |
| Packing | plywood wooden packaging |
Application:
The fiber laser marking machine can be combined with other assembly line equipment to mark on the line
2D UDI/UID Barcodes
Sequential Serial Numbers
Lot Codes and Date Codes
Medical/Automotive Coding
IC Chip Package Marking
Part Numbering
Surface Annealing/Etching
OCR Code Marking
Alphanumeric Marking
Logos and Schematics
Ablation: (Anodized/Painted/Coated)
Complex graphics/pictures
Paint removal
